Production Capability

Layers count1-24 layers
Finished Board Thickness0.003”- 0.16”(0.075mm - 6.0mm)
Max. panel size> 600×500mm
Available Laminates MaterialCEM1, CEM3, FR4, Kapton, Teflon, Polymide , Polyester, Alluminium
Finished board Thickness toleranceSTD 1,6 ±10%
Finished hole diameter (Min)CNC 0.12mm, LASER 0.10mm
Finished hole diameter (Max)6.0mm
Hole diameter tolerance (NPTH)± 1mil (±0.05mm)
Hole diameter tolerance (PTH)± 2mil (± 0.076mm)
Copper foil thickness12μm, 17.5μm, 35μm, 70μm, 105μm, > 130μm
Layer design line width/spacing (Min) (1/3 OZ)≥ 0.075mm (3mil)
Layer design line width/spacing (Min) (1 OZ)≥ 0.100mm (4mil)
Surface Finished (lead free)OSP, Immersion Gold, Gold Fingers, HAL-LF, Tin and SILVER plating
Ni thickness under gold≥ 3μm min IPC-4552
Au thickness0,05μm min IPC-4552
Immersion Tin0.7~1.2μm IPC-4554
OSP0.2-0.5μm
Drill hole true position tolerance± 0.05mm
Punching die dimension tolerance (Exact die)± 0.05mm
Punching die dimension tolerance (edge to edge)± 0.05mm
LDI Tecnology (Laser Direct Imaging) High Volume =25μm for HDI, Flex and Rigid Flex
Major Laminate HIGH CTI, HIGH TGShengYi, Doosan, Kingboard
VIA in PAD ASSEMBLY TECHNOLOGYPlated Over Filled Vias, IPC4761 Type VII
SBU-Sequential Build_up, Vias Buried and Capped
Holes Via Laserdiam <150 μm/6mils and Pads diam <400 μm/16mils
Major Laminate HIGH CTI, HIGH TGShengYi, Doosan, Kingboard

Fast Production

LAYERSPRODUCTION DAYS
* (after full engineering review)
Single-side and double side5 to 8
4 to 6 layers < 3MQ6-10
8 layers < 3MQ8-11
10 to 12 layers < 3 MQ14
14 to 20 layers < 3 MQ16

Mass Production

LAYERSPRODUCTION WEEKS
* (after full engineering review)
Single-side and double side3 to 4
4 to 8 layers4 to 5
8 to 12 layers4 to 5
12 to 20 layers5 to 6