| Layers count | 1-24 layers |
| Finished Board Thickness | 0.003”- 0.16”(0.075mm - 6.0mm) |
| Max. panel size | > 600×500mm |
| Available Laminates Material | CEM1, CEM3, FR4, Kapton, Teflon, Polymide , Polyester, Alluminium |
| Finished board Thickness tolerance | STD 1,6 ±10% |
| Finished hole diameter (Min) | CNC 0.12mm, LASER 0.10mm |
| Finished hole diameter (Max) | 6.0mm |
| Hole diameter tolerance (NPTH) | ± 1mil (±0.05mm) |
| Hole diameter tolerance (PTH) | ± 2mil (± 0.076mm) |
| Copper foil thickness | 12μm, 17.5μm, 35μm, 70μm, 105μm, > 130μm |
| Layer design line width/spacing (Min) (1/3 OZ) | ≥ 0.075mm (3mil) |
| Layer design line width/spacing (Min) (1 OZ) | ≥ 0.100mm (4mil) |
| Surface Finished (lead free) | OSP, Immersion Gold, Gold Fingers, HAL-LF, Tin and SILVER plating |
| Ni thickness under gold | ≥ 3μm min IPC-4552 |
| Au thickness | 0,05μm min IPC-4552 |
| Immersion Tin | 0.7~1.2μm IPC-4554 |
| OSP | 0.2-0.5μm |
| Drill hole true position tolerance | ± 0.05mm |
| Punching die dimension tolerance (Exact die) | ± 0.05mm |
| Punching die dimension tolerance (edge to edge) | ± 0.05mm |
| LDI Tecnology (Laser Direct Imaging) High Volume | =25μm for HDI, Flex and Rigid Flex |
| Major Laminate HIGH CTI, HIGH TG | ShengYi, Doosan, Kingboard |
| VIA in PAD ASSEMBLY TECHNOLOGY | Plated Over Filled Vias, IPC4761 Type VII |
| SBU-Sequential Build_up, Vias Buried and Capped | |
| Holes Via Laser | diam <150 μm/6mils and Pads diam <400 μm/16mils |
| Major Laminate HIGH CTI, HIGH TG | ShengYi, Doosan, Kingboard |
